发明名称 SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To stabilize quality of soldering by heating and welding a lead wire of a lead part inserted into an insertion hole of the lead wire after adhering solder particles having a higher melting point than that of cream solder adhered on a connecting pattern and heating at lower temperature than the melting point of the solder particles. SOLUTION: In this soldering method, a soldering iron is not used and this solves the quality problem of scattering of spatters from a molten solder which is caused at the time of using the soldering iron, and improves soldering quality. Moreover, heating by hot air 10 is so efficient that the process time is shortened to a few seconds, for example, to improve efficiency compared with other methods such as heating by light. And another thing, in heating by hot air 10, temperature is controlled easily and the complicated condition control such as control of the surface properties of a soldering iron tip or control of the temperature of the tip of a soldering iron is not required. As a result, the daily control of the production lines is conducted easily.
申请公布号 JP2000040873(A) 申请公布日期 2000.02.08
申请号 JP19980206825 申请日期 1998.07.22
申请人 FUJITSU TEN LTD 发明人 IKEDO KENJI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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