| 摘要 |
PROBLEM TO BE SOLVED: To achieve miniaturization for module configuration by providing an integrated circuit being arranged and formed on one side surface of a polygonal prism, and an electrode being connected to an external electrode on one surface of the side, top, and bottom surfaces of the prism. SOLUTION: On the side surface of a regular hexagonal prism 1 made of silicon, an integrated circuit element region 2 consisting of a transistor, metal wiring/via layer, and the like is formed. Also, at the circumferential part of the side surface, an electrode for connecting to an external electrode, namely, a connection terminal 3, is formed. The connection terminal 3 is used as the electrode for electrically/mechanically connecting to another semiconductor element and circuit board at the outside, and is made of aluminum or the like. To form the one-piece circuit element region 2, a corner is rounded, and continuous circuit pattern formation to the side surface can be made. An almost cylinder may be used instead of a polygonal prism, and the circuit element region may be formed according to the curved surface at the circumferential part of the curved surface of a column when the circuit element region is formed on a side-wall surface. Also, the connection terminal may be formed on the bottom or top surface of the polygonal prism/cylinder.
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