Semiconductor component, especially for an electric motor frequency converter, has an electrically non-conductive housing directly surrounding cooling bodies of a non-insulated power semiconductor housing

摘要

A semiconductor component, comprising an electrically non-conductive housing (30) directly surrounding cooling bodies (20) of a non-insulated power semiconductor housing, is new. A semiconductor component comprises (a) one or more power semiconductors with a non-insulated housing lying at an electrical operating potential; (b) one or more electrically conductive cooling bodies (20) on which the housing is fixed in good thermal contact for direct heat dissipation; and (c) an electrically non-conductive housing (30) directly surrounding at least the cooling body or bodies such that heat is transferred from the or each cooling body through the housing wall to a surrounding medium, especially ambient air. An Independent claim is also included for production of the above semiconductor component, in which the electrically non-conductive housing consists of plastic which is cast, injection moulded or deep drawn onto the cooling body or bodies.