| 摘要 |
PROBLEM TO BE SOLVED: To obtain a dust adsorbing wafer and a method of cleaning the inside of the wafer capable of suppressing the re-deposition of dust produced due to the disassembling of an apparatus and other human factors and removing dust adjacent to the wafer. SOLUTION: Dummy wafers 11a and 11b which are positively and negatively charged by a corona charge are formed. Next, the positively charged wafer 11a is forwarded idly within a semiconductor manufacturing apparatus, whereby negatively charged dust whose polarity is opposite to that of the wafer 11a is adsorbed to the wafer 11a by electrostatic force. Next, the same operation is performed for the wafer 11b. During these operations, stray dust present not only in regions which are in contact with the wafers 11a and 11b, but also within regions upon which the influence of electrostatic forces within the apparatus is exerted can be removed.
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