| 摘要 |
PROBLEM TO BE SOLVED: To provide a buildup multilayer printed wiring board which is superior in handling and hardly causes through-hole machining or resin cracks. SOLUTION: A multilayer printed wiring board comprises an inner layer board, using a both-sided board or multilayer board with a base using glass cloth or glass paper, and buildup layers to be laminated on the outside of the inner layer board and laser beam via machine using Cu foils with resin or resin films. The resin compsn. constituting the Cu foil with resin or resin film includes an epoxy ester resin contg. epoxy resin ester-bonded with a plant oil fatty acid, such as dehydrated castor oil fatty acid. |
