| 摘要 |
PROBLEM TO BE SOLVED: To protect an FPC cable part from chemical solution treatment without lowering productivity in the manufacture of a flex-rigid multilyaer wiring plate, and to easily remove the protective cover part which becomes unnecessary after chemical solution treatment. SOLUTION: An outer layer substrate 12 of a multilayer wiring part is laminated on both surface of an FPC, the substrate 12 is stuck closely or adhered to a cable part 1, and the cable part 1 is protected. After a chemical solution treatment such as alkali treatment, etc., has been performed, an outer layer substrate part 15 which became unnecessary is removed. The outer layer substrate layer 15 can be removed in a highly accurate manner by providing a slit hole 17 on the outer layer substrate in advance. |
