发明名称 |
Electric circuit has circuit board inclined so power semiconducting component e.g. MOSFET, drops out if solder melts owing to heat generated by component, and stopper parts to stop component falling out |
摘要 |
The circuit has at least one surface mount power semiconducting component (12,14) e.g. MOSFET soldered onto a circuit board (10) that is inclined so that the component will drop out if the solder melts as a result of the heat generated by the power semiconducting component and at least one stopper part (36) to prevent the component from falling out. In a state in which the stopper part is preventing the component from falling out the component adopts an electrically open state and the component is retained at the stop position as a result of its subsequent cooling. |
申请公布号 |
DE10029396(A1) |
申请公布日期 |
2001.01.04 |
申请号 |
DE2000129396 |
申请日期 |
2000.06.15 |
申请人 |
ANDEN CO., LTD.;DENSO CORP., KARIYA |
发明人 |
OTHANI, HIDEYUKI;ISHIKAWA, FUKUO;KABUNE, HIDEKI;HATTORI, HIROSHI |
分类号 |
H05K1/18;H05K1/02;H05K1/14;H05K3/34;(IPC1-7):H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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