METHOD OF COATING PHOTRESIST LAYER ON WAFER FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A photoresist coating method is provided to obtain a uniform thickness of photoresist layer without defects by uniformly coating a photoresist layer on a wafer through spraying a photoresist material while rotating the wafer in low and high speeds. CONSTITUTION: A wafer is loaded on a rotation chuck. A nozzle is located to the center of the wafer for spraying a photoresist material. The photoresist material is sprayed for 1 to 15 seconds through a nozzle fixed to a central position of the wafer while rotating the rotation chuck loaded with the wafer in a low speed of 50 to 250 rpm. The rotation chuck loaded with the wafer is rotated in a high speed of 200 to 5000 rpm. Then, a photoresist layer is formed on the wafer. The wafer is unloaded from the rotation chuck for next process.