SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To obtain a highly reliable semiconductor device of a structure, wherein a semiconductor element is flip-chip mounted on a wiring board without breaking the element and the heat dissipation property of the element is enhanced. SOLUTION: A semiconductor device is one constituted by connecting a semiconductor element 1 to a wiring board 3 by a flip-chip bonding method and the joint of a cap 5 provided on the board 3 with the rear of the surface of the element 1 provided with an active layer, is conducted through a metal solid phase diffusion joint layer 91.