| 摘要 |
<p>An electrolytic copper foil with a carrier foil having a carrier foil, a bonding interface layer formed thereon, and an electrolytic copper foil formed on the interface layer, characterized in that the carrier foil is a copper foil and the bonding interface layer comprises a mixture of an organic material and metal particles; and a method for manufacturing the electrolytic copper foil with a carrier foil. The electrolytic copper foil with a carrier foil having a carrier foil allows the control of the minimum value of a peeling adhesion strength between the carrier foil and the electrolytic copper foil.</p> |
