发明名称 |
METHOD FOR FABRICATING VACUUM-PACKED SILICON ANGULAR VELOCITY SENSOR |
摘要 |
PURPOSE: A method for fabricating a vacuum-packed silicon angular velocity sensor is provided to improve the sensitivity by bonding the glass defining a vacuum region with a silicon substrate having a vibrator. CONSTITUTION: An oxide layer(20) and a nitride layer(30) as insulating layers are formed on a silicon substrate(10). The oxide layer(20) having the thickness of 1 micro meter is formed by a wet etch method. The nitride layer(30) having the thickness of 0.3 micro meter grows by a chemical vapor deposition method. A sacrificial layer(40) having the thickness of 1.5 micro meter is grown by a chemical vapor deposition method. The polysilicon for forming a vibrator(50) grows thereon. The polysilicon is etched by using a photo etch method. The vibrator(50) and a driver electrode are formed by removing the sacrificial layer(40). A small-sized angular velocity sensor is formed by boning a glass substrate(60) of a pyrex #7740 with the silicon substrate(10).
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申请公布号 |
KR100298810(B1) |
申请公布日期 |
2001.06.04 |
申请号 |
KR19970074926 |
申请日期 |
1997.12.27 |
申请人 |
RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY |
发明人 |
KIM, GWANG IL;KO, JAE SEOK;LEE, GWANG CHEOL |
分类号 |
H01L29/84;(IPC1-7):H01L29/84 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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