发明名称 METHOD FOR FABRICATING VACUUM-PACKED SILICON ANGULAR VELOCITY SENSOR
摘要 PURPOSE: A method for fabricating a vacuum-packed silicon angular velocity sensor is provided to improve the sensitivity by bonding the glass defining a vacuum region with a silicon substrate having a vibrator. CONSTITUTION: An oxide layer(20) and a nitride layer(30) as insulating layers are formed on a silicon substrate(10). The oxide layer(20) having the thickness of 1 micro meter is formed by a wet etch method. The nitride layer(30) having the thickness of 0.3 micro meter grows by a chemical vapor deposition method. A sacrificial layer(40) having the thickness of 1.5 micro meter is grown by a chemical vapor deposition method. The polysilicon for forming a vibrator(50) grows thereon. The polysilicon is etched by using a photo etch method. The vibrator(50) and a driver electrode are formed by removing the sacrificial layer(40). A small-sized angular velocity sensor is formed by boning a glass substrate(60) of a pyrex #7740 with the silicon substrate(10).
申请公布号 KR100298810(B1) 申请公布日期 2001.06.04
申请号 KR19970074926 申请日期 1997.12.27
申请人 RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY 发明人 KIM, GWANG IL;KO, JAE SEOK;LEE, GWANG CHEOL
分类号 H01L29/84;(IPC1-7):H01L29/84 主分类号 H01L29/84
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