| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive circuit forming transfer material, a conductive circuit substrate obtained by using the same, and its manufacturing method, in which in the conductive circuit substrate obtained by transferring the conduc tive circuit forming transfer material on the circuit substrate, scratches or corrosions do not easily generate in a conductive layer, and an increase in circuit resistance with time is restricted, and it is possible to transfer to even the circuit substrate having a sharp curved face profile, or complicated profile upon molding. SOLUTION: In a conductive circuit, forming a transfer material and a conductive circuit substrate obtained by transferring the same, on one face of a plastic film, a separation layer of a surface resistivity 102 to 109Ω.cm, a conductive layer in which a conductive circuit is formed, and an adhering layer containing a conductive agent migration inhibitor of 1 to 50 PHR are formed in the order. A circuit resistivity after transferred is 0.03 to 2.5Ω.cm in a 3.5 mm-width line. An in-mold molding transfer is made possible in transferring.
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