发明名称 |
ODORLESS ADHESIVE FOR WOODEN BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide an odorless formaldehyde-based thermosetting resin adhesive for wooden board, capable of reducing the amount of formaldehyde to be released without deteriorating adhesiveness and curing properties. SOLUTION: This odorless adhesive for wooden board is produced by adding an allylamine-based polymeric compound to a formaldehyde-based thermosetting resin adhesive.
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申请公布号 |
JP2001240835(A) |
申请公布日期 |
2001.09.04 |
申请号 |
JP20000053154 |
申请日期 |
2000.02.29 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
FUNAOKA SOUHEI;ONO KOJI;ITO MIKIO |
分类号 |
B27D1/04;C09J139/02;C09J161/00;(IPC1-7):C09J161/00 |
主分类号 |
B27D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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