发明名称 ODORLESS ADHESIVE FOR WOODEN BOARD
摘要 PROBLEM TO BE SOLVED: To provide an odorless formaldehyde-based thermosetting resin adhesive for wooden board, capable of reducing the amount of formaldehyde to be released without deteriorating adhesiveness and curing properties. SOLUTION: This odorless adhesive for wooden board is produced by adding an allylamine-based polymeric compound to a formaldehyde-based thermosetting resin adhesive.
申请公布号 JP2001240835(A) 申请公布日期 2001.09.04
申请号 JP20000053154 申请日期 2000.02.29
申请人 SUMITOMO BAKELITE CO LTD 发明人 FUNAOKA SOUHEI;ONO KOJI;ITO MIKIO
分类号 B27D1/04;C09J139/02;C09J161/00;(IPC1-7):C09J161/00 主分类号 B27D1/04
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