| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for housing an electronic part, especially, an integrated circuit in a cured plastic case, capable of bonding a substance to the case of the electronic part as an entire or partial coating and capable of providing a pattern of every kind on the outer surface of the part. SOLUTION: The electronic part is placed in the cavity of a split mold and, before a substance is injected in the cavity, a film capable of being peeled from a wall is placed between the electronic part and the mold and a plastic material is injected in the space between the part and the film. Since the bonding strength to the warm injected plastic material housing the part is larger than that to the film, the substance becoming the state of being bonded to the plastic case at the time of taking-out of the plastic material from the mold after cooling is carried on the side facing 4o the part from the film.
|
