| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound semiconductor wafer that can reduce the damage such as crack and cutout. SOLUTION: This wafer has a surface with projections where Total Thickness Variation(TTV) of a wafer flatness index is equal to 10μm or less, and at the same time Warp (Warp) that is the index of the degree of warpage, and the bend that is indicated by Sori (Bend) becomes 20μm or less.
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