| 摘要 |
PROBLEM TO BE SOLVED: To fix the lead frame assembly and heat sink of a resin sealed lead frame assembly by a resin sealant without using an adhesive. SOLUTION: The heat sink (22) of the resin sealed lead frame assembly (42) has a metal plate (28), and a non-adhesive insulation film (29) formed on one main face of the metal plate (28). A projection part (41a) engaged with a groove part (28a) formed on the side of the metal plate (28) is formed on a resin sealant (41), and the lead frame assembly (21) and the heat sink (22) are integrally held. Since the non-adhesive film (29) is used, the heat sink (22) and a support plate (23) are electrically separated through the insulation film (29), and the adhesive and a process for applying the adhesive can be eliminated. |
