| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligner which can reduce the thermal expansion influence of a wafer on the exposing position accuracy when exposing the wafer expecting the effect of the exposure accuracy improvement. SOLUTION: Portions with no shipped part are first exposed and the portions having chipped parts are last exposed. A means is provided for introducing a heat transfer gas at a pressure of several Torr between a wafer and chuck to introduce the gas such as helium into a heat transfer gas introducing trench cut into the chuck surface. Flowing a liquid in eth chuck holds the temperature constant between the wafer and the chuck. Thus, the means for the heat transfer gas is combined with a shot order changing means.
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