| 摘要 |
An apparatus for chemical-mechanical polishing is disclosed. The apparatus includes the following elements. A pump is used for forcing slurry to be flown inward to receive the slurry from a supply reservoir. A first pipe having a first end, is coupled to an outlet of the forcing means through which the forced slurry flows therein. A megasonic generator coupled in approximately midway of the first pipe and surrounded the first pipe, is used for generating megasonic wave. A second pipe, coupled to a second end of the first pipe, is used for conducting the slurry and then exhausting the slurry through an outlet of the second pipe. A polishing pad, onto that the slurry from the second pipe is dropped, is fixed on a polishing table. The polishing table underlying the polishing pad is used for supporting the polishing pad. A wafer holder, located above the polishing pad, is used for fixing the wafer to the wafer holder while in rotational movement with respect to the polishing pad.
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