发明名称 APPARATUS FOR COUPLING HEAD SINK
摘要 PURPOSE: An apparatus for coupling a heat sink is provided to easily fix and dissemble the heat sink and a printed circuit board by a simple operation that an operator presses an elastic supporting unit and transfers a support plate. CONSTITUTION: A shaft(11) is inserted into a coupling hole(3) and a combination hole(6), having a fixing groove(13) of a ring type at an end side passing through the combination hole. A support plate(16) is in contact with a lower surface of a printed circuit board(5), having an incision groove to which the shaft is inserted from a side of the support plate. A clamp member(15) is bent and extended by a predetermined angle from a side of the incision groove of the support plate, having an upward/downward elastic displacement. A pair of elastic supporting units(18) supports the fixing groove of the shaft, formed at the end of the clamp member.
申请公布号 KR20020000380(A) 申请公布日期 2002.01.05
申请号 KR20000035054 申请日期 2000.06.24
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SON, BYEONG UK
分类号 H01L23/36;(IPC1-7):H01L23/36 主分类号 H01L23/36
代理机构 代理人
主权项
地址