| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for an interposer which has excellent solder resistance by high heat resistance, low thermal expansion and a low water absorption property, to provide its prepreg, and to provide its cooper clad laminated plate. SOLUTION: The epoxy resin for the interposer is composed of (A) an epoxy resin having structure represented by the following formula (1) (wherein, G represents a glycidyl group), (B) a phenol resin curing agent having three or more phenolic hydroxyl groups in one molecule, (C) a flame retardant and (D) a spherical molten silica as an essential component, and preferably, of (E) a coupling agent.
|
