发明名称 |
PASTE SUPPLY DEVICE OF ELECTRONIC COMPONENT MOUNTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a paste supply device of an electronic component mounting device which can secure mounting quality by preventing a paste transfer quantity from having variance. SOLUTION: The paste supply device supplies paste in a coating state of specific film thickness. A turntable 16 which reserves the paste 19 in a recessed part 16a is equipped with a 1st squeeze 17A which levels the surface of the paste 19 as a turntable 16 has its end arranged at a specific interval above the bottom surface of the recessed part 16a and rotates relatively, and 2nd squeezes 17B and 17C which are arranged in front of the 1st squeeze 17A and scrape the paste 10 on the bottom surface together to a center part in a radial direction through the rotation of the turntable 16. Consequently, the paste 19 on the turntable 16 is prevented from having partiality to supply a uniform paste film 19a.
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申请公布号 |
JP2002141655(A) |
申请公布日期 |
2002.05.17 |
申请号 |
JP20000335495 |
申请日期 |
2000.11.02 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NISHIDA MASABUMI |
分类号 |
H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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