| 摘要 |
PROBLEM TO BE SOLVED: To markedly increase external connecting terminals, without increasing the package size. SOLUTION: An external electrode 17 provided in a CSP-type semiconductor device 1 has a bump 16 formed at an electrode 9 for the bump, and a connecting pin 10. The bump 16 is connected to a wiring pattern 5 via the electrode 9 for the bump and a through-hole 9a. The pin 10 is inserted into the hole 9a. One end is connected to a wiring pattern 7 via a conductive adhesive 11, such as solder paste or the like, and the other end is provided to protrude in a length from the electrode 9. Thus, electrodes for two pins are formed at the one external electrode 17. |
