| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems that losses occur due to overlapping setting work in a final test process and a taping process and that extension is realistically impossible while throughput depends on the number of electrical inspection stations in the final test process. SOLUTION: This IC handling and taping device is provided with a taping rail distributed by a distributing device from the IC handling device provided with the distributing device provided with a rail inclination altering mechanism for transferring inspected ICs from an electrical inspection completing vertical rail of the electrical inspection station to each classification rail with an inclination for classification according to the results of inspection, a rail direction rotating and converting mechanism, and a slide positioning mechanism. In addition, the electrical inspection station provided with an IC supply mechanism from a tube housing a plurality of ICs to an electrical inspection socket part is provided with a stage for extension capable of extending the supply mechanism.
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