WIRING BOARD FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To solve the problem of a decrease in thermal conductivity and a deterioration in electrical characteristics caused by its structure and material property in a conventional wiring board for a semiconductor device. SOLUTION: A plurality of conductive materials 11 covered with an insulating coating material 12 on the surface thereof is put in a bundle and fixed with an insulating adhesive 15, and sliced into each anisotropic conductive board as the wiring board for the semiconductor device. Then the electrical resistance and inductance between the upper and lower faces of the board are made markedly small, so the semiconductor device with electrical and thermal advantages can be obtained.