| 摘要 |
A method and a device are proposed for delacquering a mask substrate, in the case of which, in particular, the edge zone of a photomask is delacquered. During the mask production, the mask substrate is coated over its entire surface with a layer of photoresist by the production process. The side edges can also be coated with resist in this case. During later handling of the mask substrates, very small resist particles can come loose, for example owing to handling tools such as mask pincers, and lead through deposits on the emulsion side to defects in the layout of the mask substrates such that the photomask can then no longer be used in practice. This fault can be avoided by delacquering the edge zone with the aid of a chemical etching reaction, in particular by using an ozone-containing gas.
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