发明名称 METHOD AND APPARATUS FOR FORMING FILM AND INSULATION FILM, AND SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a film capable of forming a boron-carbon-nitrogen film. SOLUTION: The method for forming the film comprises the steps of generating a plasma 50 in a cylindrical container 1, mainly exciting nitrogen atoms in the container 1, then reacting boron with carbon, and forming the boron- carbon-nitrogen film 61 on a substrate 60.
申请公布号 JP2002359242(A) 申请公布日期 2002.12.13
申请号 JP20010203688 申请日期 2001.07.04
申请人 WATANABE SHOKO:KK;SUGINO TAKASHI 发明人 SUGINO TAKASHI;KUSUHARA MASAKI;UMEDA MASARU
分类号 C23C16/38;C23C16/36;C23C16/452;C23C16/509;H01L21/31;H01L21/314;H01L21/318;H01L21/768;H01L23/522;(IPC1-7):H01L21/318 主分类号 C23C16/38
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