| 摘要 |
PROBLEM TO BE SOLVED: To provide a head chip and a method of manufacturing the same wherein contamination in a recessed section can be readily removed and the cost for the manufacturing is reduced. SOLUTION: This head chip 11 comprises a substrate 16 having a plurality of chambers 17 each having an opening at one end face, an ink chamber plate 20 which is bonded to one face of the substrate 16 and has a common ink chamber 21 for the chambers 17 formed thereon, a nozzle plate 23 having nozzles 24 to be bonded to the edge face of the ink chamber plate 20, and a nozzle support plate 26 to be bonded to end external side faces of the substrate 16 and the ink chamber plate 20 at the side of the nozzle plate 23. A recessed section 25 is formed at a portion around the nozzles on one face of the nozzle plate 23 for ejecting ink drops by bending the surface of the one face.
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