| 摘要 |
PROBLEM TO BE SOLVED: To obtain a simple and inexpensive system for mirror finishing a wafer in which maintenance cost can also be reduced by employing a simple structure where the radius r of an abrasive cloth is not required to be grasped or managed. SOLUTION: In the system for mirror finishing a wafer, first slide means (152, 154) can be positioned at two positions separated by a distance equal to the interval of two abrasive discs 8a and 8b and the notch of a wafer W supported on a wafer chuck table 12 is disposed relatively at a position facing one of two abrasive discs 8a and 8b at each of two positions. Second slide means (141, 142) are provided with means comprising a weight 19 and a wire 18 for urging the abrasive discs 8a and 8b and the wafer W supported on the wafer chuck table 12 in the direction pushing each other.
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