| 摘要 |
PROBLEM TO BE SOLVED: To provide an extremely effective wiring board device in which the circuit board electrode is arranged to stand sufficiently against mechanical impacts, and to suppress generation of solder balls as much as possible. SOLUTION: In the wiring board device, an electronic component 1 is mounted on the electrode 5 of a circuit board 4 through solder 6, and a specified region on the circuit board is covered with solder resist 3 of heat resistant coating material. An over-resist structure where the solder resist is applied to overlap at least a part of the electrode is employed at an outer part 5a of the circuit board electrode facing the outside from the edge (g) of the electronic component. At the inner part 5b of the circuit board electrode facing the inside from the edge of the electronic component, a clearance structure where the solder resist is applied at least to a part of the electrode at a specified interval is employed.
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