| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package in which a solder ball is easily placed, there is no necessity to form a solder resist, to wash and remove remaining flux after solder joint, and to fill with under fill, etc., electrical insulation is kept even under a high temperature and a humid atmosphere, and solder joint of high joint strength and high reliability is enabled, and a method for manufacturing the package. SOLUTION: This method includes a process wherein a negative photosensitive resin, a photo polymerization starting agent, a heat curing resin and a composition of negative photosensitive resin comprising a compound containing organic acid and/or phenolic hydroxyl group as a curing agent for the heat curing resin are applied to a circuit pattern provided with a solder ball mounting land, a process wherein the land is masked for irradiating with an active energy line, a process wherein the solder ball is placed in a part where is not exposed to the active energy line, and a process wherein heating is performed in a reflow furnace. By this method, metal joint between the solder ball and the land is formed. COPYRIGHT: (C)2003,JPO
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