发明名称 High speed and density circular connector for board-to-board interconnection systems
摘要 A system and method for interconnecting circuit boards is disclosed. In one embodiment, a first circuit board connects with a second circuit board via a connector. The first circuit board has an aperture with a plurality of conductive surfaces on an inner surface. At least one of the conductive surfaces is coupled to at least one of a plurality of first circuit board traces. The second circuit board has a plurality of second circuit board traces. Therebetween, the connector has a plurality of conductive signal conductors, each having a first portion disposed at the periphery of the connector and adjacent to the conductive surfaces and a second portion coupled with the second circuit board traces.
申请公布号 US6609914(B2) 申请公布日期 2003.08.26
申请号 US20010921152 申请日期 2001.08.02
申请人 INCEP TECHNOLOGIES, INC. 发明人 DIBENE, II JOSEPH T.
分类号 G06F1/18;H01L23/427;H01R4/64;H01R12/16;H05K1/02;H05K1/14;H05K3/30;H05K3/36;H05K7/10;H05K7/20;(IPC1-7):H01R9/09 主分类号 G06F1/18
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