发明名称 Method of controlling grain size in a polysilicon layer and in semiconductor devices having polysilicone structures
摘要 A method of modulating grain size in a polysilicon layer and devices fabricated with the method. The method comprises forming the layer of polysilicon on a substrate; and performing an ion implantation of a polysilicon grain size modulating species into the polysilicon layer such that an average resultant grain size of the implanted polysilicon layer after performing a pre-determined anneal is higher or lower than an average resultant grain size than would be obtained after performing the same pre-determined anneal on the polysilicon layer without a polysilicon grain size modulating species ion implant.
申请公布号 US2003216013(A1) 申请公布日期 2003.11.20
申请号 US20020147270 申请日期 2002.05.15
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GEISS PETER J.;GRECO JOSEPH R.;KONTRA RICHARD S.;LANNING EMILY
分类号 H01L21/28;H01L21/20;H01L21/265;H01L21/331;H01L21/822;H01L27/04;H01L29/08;H01L29/49;H01L29/732;H01L29/78;(IPC1-7):H01L21/20;H01L21/36;H01L21/425 主分类号 H01L21/28
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