| 摘要 |
Multi-level semiconductor devices are formed with reduced parasitic capacitance without sacrificing structural integrity or electromigration performance by removing the inter-layer dielectrics and depositing a metal silicide to line the interconnection system. Embodiments include a semiconductor device comprising a dielectric sealing layer, e.g., silicon nitride, between the substrate and first patterned metal layer, tungsten silicide lining the interconnection system and dielectric protective layers, e.g., a silane derived oxide bottommost protective layer, on the uppermost metallization level.
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