| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which is improved in adhesion to a sealing resin and reduced in adhesion to it in a gate region, and to provide its manufacturing method. SOLUTION: A metal plating layer that has high resistance to a surface roughening process and is low in adhesion to the sealing resin is previously formed in the gate region. Thereafter, the whole of the surface of the lead frame including the gate region is subjected to a roughening process. At this point, the roughening process is carried out under a condition that the surface of the metal plating layer formed on the gate electrode is kept smooth. COPYRIGHT: (C)2004,JPO |
