STRUCTURED INTEGRATED CIRCUIT DEVICE WITH MULTIPLE CONFIGURABLE VIA LAYERS

摘要

An integrated circuit may include a multi-layer structure having alternating metal interconnection layers and via layers superimposed on a base layer having electronic components, functional blocks, or both. At least two of the via layers may be customizable and may be used to form customized interconnections that may customize functionality of the resulting integrated circuit. In a variant, at least some of the layers may have a default structure that may result in a default integrated circuit functionality; the default structure may be changed to customize functionality. One or more metal interconnection layers may also be customizable. Additionally, transistors of the base layer may be customized for speed and/or power consumption by adjusting voltage thresholds and/or gate lengths.

主权项

1. An integrated circuit, including:
transistor layers comprising electronic components or functional blocks or both; a plurality of alternating metal interconnection layers and via layers, superimposed on the transistor layers, and configured to form interconnections among the electronic components or functional blocks or both, wherein the plurality of alternating metal interconnection layers and via layers includes at least two customizable via layers; and a contact layer disposed between the plurality of alternating metal interconnection layers and via layers and the transistor layers and configured to provide connectivity between the transistor layers and at least one of the plurality of metal interconnection layers.