HEAT SINK FOR SEMICONDUCTOR COMPONENTS OR SIMILAR DEVICES, METHOD FOR PRODUCING THE SAME AND TOOL FOR CARRYING OUT SAID METHOD

摘要

A cooling system for semiconductor elements and similar devices, especially of extruded pressed aluminum alloy, comprises cooling fins (20) extending from a base (12) to which they are joined by couplings of rectangular cross section (24) which fit into insertion slots in the base and are then cold-welded. Independent claims are also included for the following: (a) a process for producing the cooling system above; and (b) a tool for fitting the fins in the production process.