| 摘要 |
FIELD: cooling and shielding electronic components as well as parts and assemblies of machines. ^ SUBSTANCE: proposed device designed for cooling equipment in enclosed spaces where energy sources are scarce and for shielding equipment against vibration impacts and radiation has solid-state heat sink assembled of a number of shaped wafers made of alloy possessing transformation induced plasticity. Wafers are originally shaped as open cylinders inserted one into other and equidistantly secured with aid of a number of rings and locking cover on equipment being cooled. When wafers are heated to critical temperature, their cylindrical shape transforms to rectangle with desired geometric proportions of heights and bases of each wafer. ^ EFFECT: enhanced reliability and enlarged functional capabilities. ^ 1 cl, 4 dwg |
