发明名称 |
Electroetching process and system |
摘要 |
A system for optionally depositing or etching a layer of a wafer includes mask plate opposed to the wafer with the mask plate having a plurality of openings that transport a solution to the wafer. An electrode assembly has a first electrode member and a second electrode member having channels that operatively interface a peripheral and center part of the wafer. The channels transport the solution to the mask.
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申请公布号 |
US6852630(B2) |
申请公布日期 |
2005.02.08 |
申请号 |
US20010841622 |
申请日期 |
2001.04.23 |
申请人 |
ASM NUTOOL, INC. |
发明人 |
BASOL BULENT M.;UZOH CYPRIAN;YAKUPOGLU HALIT N.;TALIEH HOMAYOUN |
分类号 |
B23H5/08;C25F3/14;H01L21/288;H01L21/321;H01L21/3213;H01L21/768;(IPC1-7):H01L21/302 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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