发明名称 Electroetching process and system
摘要 A system for optionally depositing or etching a layer of a wafer includes mask plate opposed to the wafer with the mask plate having a plurality of openings that transport a solution to the wafer. An electrode assembly has a first electrode member and a second electrode member having channels that operatively interface a peripheral and center part of the wafer. The channels transport the solution to the mask.
申请公布号 US6852630(B2) 申请公布日期 2005.02.08
申请号 US20010841622 申请日期 2001.04.23
申请人 ASM NUTOOL, INC. 发明人 BASOL BULENT M.;UZOH CYPRIAN;YAKUPOGLU HALIT N.;TALIEH HOMAYOUN
分类号 B23H5/08;C25F3/14;H01L21/288;H01L21/321;H01L21/3213;H01L21/768;(IPC1-7):H01L21/302 主分类号 B23H5/08
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