Three dimensional integrated circuit structure and method of manufacturing the same

摘要

Provided is a three dimensional integrated circuit structure including a first die, a through substrate via and a connector. The first die is bonded to a second die with a first dielectric layer of the first die and a second dielectric layer of the second die, wherein a first passivation layer is between the first dielectric layer and a first substrate of the first die, and a first test pad is embedded in the first passivation layer. The through substrate via penetrates through the first die and is electrically connected to the second die. The connector is electrically connected to the first die and the second die through the through substrate via.

主权项

1. A three dimensional integrated circuit structure, comprising:
a first die bonded to a second die with a first dielectric layer of the first die and a second dielectric layer of the second die, wherein a first passivation layer is between the first dielectric layer and a first substrate of the first die, and a first test pad is formed in the first passivation layer and extending to the first dielectric layer; first redistribution lines embedded in the first dielectric layer; a through substrate via penetrating through the first die and electrically connected to the second die; and a connector electrically connected to the first die and the second die through the through substrate via.