Embedded air core inductors for integrated circuit package substrates with thermal conductor

摘要

Embedded air core inductors are described for integrated circuit package substrates. The substrates have a thermal conductor for the inductors. One example includes a package substrate to carry an integrated circuit die, the package substrate having a plurality of top side pads to connect to the die on a top side and a plurality of bottom side pads to connect to an external component on a bottom side. An inductor is embedded within the package substrate, A thermal conductor is embedded within the package substrate adjacent to the inductor to conduct heat away from the inductor, and a heat sink is thermally coupled to the thermal conductor to receive the heat from the conductor.

主权项

1. An apparatus comprising:
a package substrate to carry an integrated circuit die, the package substrate having a plurality of top side pads to connect to the die on a top side and a plurality of bottom side pads to connect to an external component on a bottom side; an inductor embedded within the package substrate; a thermal conductor embedded within the package substrate adjacent to the inductor to conduct heat away from the inductor; and a heat sink thermally coupled to the thermal conductor to receive the heat from the conductor.