发明名称 Method for manufacturing a printed circuit board
摘要 Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without perfolining a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.
申请公布号 US9491866(B2) 申请公布日期 2016.11.08
申请号 US201113809083 申请日期 2011.07.07
申请人 LG INNOTEK CO., LTD. 发明人 Lee Sang Myung;Kim Byeong Ho;Kim Jin Su;Nam Myoung Hwa;Seo Yeong Uk;Yoon Sung Woon
分类号 H05K3/06;H05K3/10;H05K3/00;H05K3/02;H05K3/46;H05K3/04 主分类号 H05K3/06
代理机构 Saliwanchik, Lloyd & Eisenschenk 代理人 Saliwanchik, Lloyd & Eisenschenk
主权项 1. A method for manufacturing a printed circuit board, the method comprising: preparing an insulation board; forming a first circuit pattern groove and a via hole by removing a surface of the insulation board by using a multi tone mask or a gray tone mask, wherein the first circuit pattern groove has an edge; forming a second circuit pattern groove by removing the edge of the first circuit pattern groove, wherein the second circuit pattern groove is a final result of etching the edge of the first circuit pattern groove to form a curved shape; and forming a circuit pattern and a via to fill the second circuit pattern groove and the via hole; wherein the multi tone mask or the gray tone mask have a first region for forming an outer circumference of the via hole and the first circuit pattern groove, a second region for forming a central area of the via hole, and a third region defined in a region that is not etched; wherein the first region comprises a first part spaced apart from the second region, and a second part surrounding the second region; wherein the first circuit pattern groove and the via hole are formed at the same time by using the first region, the second region, and the third region of the multi tone mask or the gray tone mask; and wherein the second circuit pattern groove has a semicircle cross-sectional shape.
地址 Seoul KR