VORRICHTUNG ZUR ABSTUETZUNG VON FASSADENPLATTEN AN GEBAEUDEN,申请号DE19770001354U-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	VORRICHTUNG ZUR ABSTUETZUNG VON FASSADENPLATTEN AN GEBAEUDEN
摘要
申请公布号	DE7701354(U1)	申请公布日期	1977.08.04
申请号	DE19770001354U	申请日期	1977.01.19
申请人	FA. HANS SCHERFF, 5990 ALTENA	发明人
分类号	E04F13/08;(IPC1-7):E04F13/08	主分类号	E04F13/08
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Continuous dosing of extremely fast initiators during polymerization reactions

Compositions comprising glycidyl ether copolymers

Composition for treating infectious diseases caused by Helicobacter

Modulators of muscarinic receptors

Gel coat formulation

Pyrazole derivatives, preparation thereof, and therapeutic use thereof

Spiro (piperidine-4,2′-pyrrolidine)-1-(3,5-trifluoromethyl phenyl) methylcarboxamides as NK1 tachikynin receptor antagonists

Pyrrole derivatives as pharmaceutical agents

Elastin-like polymer delivery vehicles

Resuscitation fluid

Use of modified oligo-&bgr;-(1,3)-glucans for treating diseases of the immune system, oligo-&bgr;-(1,3)-glucan-(1,3)-mannose, oligo-&bgr;-(1,3)-glucan-(1,3)-mannitol and derivatives thereof, methods for preparing them and medicaments containing them

Carbon reinforced concrete

Method of fabricating semiconductor device

Epitaxial lift off stack having a multi-layered handle and methods thereof

Transistor and method for manufacturing the transistor

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Method of manufacturing semiconductor light emitting device

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Rapid patterning of nanostructures

Integrated circuit package on package system