| 发明名称 |
PREPARATION OF SEMICONDUCTOR WAFER |
| 摘要 |
PURPOSE:To bevel an ingot by bringing it into contact with a multi-cutting edgebite in which a plurality of teeth each having a conical shape in section are arranged adjacent each other.
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| 申请公布号 |
JPS52117059(A) |
申请公布日期 |
1977.10.01 |
| 申请号 |
JP19760033948 |
申请日期 |
1976.03.27 |
| 申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
MORI SHIYOUZABUROU |
| 分类号 |
H01L21/304 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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