发明名称 |
Semiconductor structure and manufacturing method thereof |
摘要 |
A semiconductor structure includes a conductive bump for disposing over a substrate and an elongated ferromagnetic member surrounded by the conductive bump, including a first end and a second end, and extending from the first end to the second end, the elongated ferromagnetic member is disposed substantially orthogonal to the substrate to dispose the conductive bump at a predetermined orientation and at a predetermined position of the substrate. Further, a method of manufacturing a semiconductor structure includes providing a substrate, forming a conductive trace within the substrate, applying an electric current passing through the conductive trace to generate an electromagnetic field and disposing a conductive bump including an elongated ferromagnetic member in a predetermined orientation and at a predetermined position above the substrate in response to the electromagnetic field generated by the conductive trace. |
申请公布号 |
US9472523(B2) |
申请公布日期 |
2016.10.18 |
申请号 |
US201414155152 |
申请日期 |
2014.01.14 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
Miao Chia-Chun;Liang Shih-Wei;Wang Yen-Ping;Wu Kai-Chiang;Liu Ming-Kai |
分类号 |
H01L23/48;H01L23/00 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
Shih Chun-Ming |
主权项 |
1. A semiconductor structure, comprising:
a conductive bump for disposing over a substrate; and an elongated ferromagnetic member surrounded by the conductive bump, including a first end and a second end, and extended from the first end to the second end, wherein the elongated ferromagnetic member is disposed substantially orthogonal to the substrate, and a center of the conductive bump is disposed on a central axis of the elongated ferromagnetic member. |
地址 |
Hsinchu TW |