Method for manufacturing semiconductor device

摘要

The reliability of multipoint contact by a contact pin with an external terminal is improved while achieving an improvement in easiness of manufacture of the contact pin. The contact pin includes first and second contact pins. Further, the first contact pin has a support portion extending in a y direction and a tip portion connected to the support portion. The second contact pin also has a support portion extending in the y direction and a tip portion connected to the support portion. Here, the support portion of the first contact pin and the support portion of the second contact pin are arranged side by side along an x direction in a horizontal plane (xy plane). Further, the tip portion of the second contact pin is shifted from the tip portion of the first contact pin along the y direction in the horizontal plane, crossing (perpendicular to) the x direction.

主权项

1. A method of inspecting a semiconductor device, comprising the steps of:
(a) electrically connecting a semiconductor chip and an external terminal; (b) after the step (a), sealing the semiconductor chip with resin such that a first surface of the external terminal is exposed, and forming a sealing body; (c) after the step (b), setting the semiconductor device to a jig, and contacting a contact pin with the first surface of the external terminal; and (d) after the step (c), inspecting electrical characteristics of the semiconductor device by supplying a current to the external terminal through the contact pin, wherein the contact pin is comprised of a first contact pin including a first tip portion to be contacted with a first portion of the external terminal, and a second contact pin including a second tip portion to be contacted with a second portion of the external terminal, wherein the first contact pin includes a first support portion, and the first tip portion connected to the first support portion, wherein the second contact pin includes a second support portion, and the second tip portion connected to the second support portion, wherein the first support portion of the first contact pin and the second support portion of the second contact pin are arranged side by side along a first direction parallel to a lower surface of the sealing body, and wherein the second tip portion of the second contact pin is shifted from the first tip portion of the first contact pin along a second direction parallel to the lower surface of the sealing body and also intersecting with the first direction.