半导体装置,申请号TW06512007-传众专利搜索

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法人/股东/高管

发明名称	半导体装置
摘要
申请公布号	TW027801	申请公布日期	1979.12.01
申请号	TW06512007	申请日期	1976.09.27
申请人	三菱电机株式会社	发明人	小内真英
分类号	H01L23/498	主分类号	H01L23/498
代理机构		代理人	陈灿晖台北巿城中区武昌街一段六十四号八楼
主权项
地址	日本东京都千代田区丸内2丁目2番3号

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