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发明名称
THERMOCOMPRESSION BONDING METHOD
摘要
申请公布号
JPS558362(A)
申请公布日期
1980.01.21
申请号
JP19780081309
申请日期
1978.07.03
申请人
NIPPON ELECTRIC CO
发明人
OKAMOTO HIDEO
分类号
B23K20/00;H01L21/60;H01L21/603
主分类号
B23K20/00
代理机构
代理人
主权项
地址
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