Test socket with hook-like pin contact edge

摘要

The present invention provides a test socket adaptable for testing different Integrated Circuit (IC) pad size during an IC testing. The test socket comprising a molded socket having an inner space and a plurality of through-apertures disposed on its surface; and a plurality of contact elements disposed within the inner space of the molded socket, each contact element has a pin contact edge and a pin-end; wherein each pin contact edge extends through the through-apertures of the molded socket; wherein each pin contact edge provides a linear surface area for contact with the DUT's lead; and wherein each pin contact edge provides a large contact area for various DUT's lead size.

主权项

1. A test socket adaptable for testing a Device Under Test (DUT) with leads, the test socket comprising:
a molded socket having an inner space and a plurality of through-apertures disposed on its surface; a floating nest supported by a plurality of springs on top of the molded socket, wherein the DUT is placed onto the floating nest during test; a socket cap with an opening in the center of the socket cap, wherein the socket cap is adapted for capping above the molded socket for holding the floating nest in place; and a plurality of contact elements disposed within the inner space of the molded socket, each contact element has a pin contact edge and a pin-end, wherein each pin contact edge extends through the through-apertures of the molded socket for contacting with the DUT during test; wherein each pin contact edge defines a linear surface area for contacting with the DUT's lead; and wherein each pin contact edge provides a large contact area relative to contact top for various DUT's lead size.