Probe card

摘要

A probe card, includes, a wiring substrate having an opening portion and including a first connection pad and a second connection pad, the first connection pad being arranged at a periphery of the opening portion, the second connection pad being arranged to be adjacent to the first connection pad, a resin portion formed inside the opening portion of the wiring substrate, a first wire buried in the resin portion and having one end connected to the first connection pad and the other end constituting a first contact terminal protruding from a lower face of the resin portion, and a second wire buried in the resin portion and having one end connected to the second connection pad and the other end constituting a second contact terminal protruding from a lower face of the resin portion.

主权项

1. A probe card, comprising:
a wiring substrate including an insulating layer and a wiring layer formed on the insulating layer; an opening portion penetrating the insulating layer and the wiring layer of the wiring substrate in a thickness direction, the opening portion having a quadrangle shape in a plan view, wherein four side faces of the opening portion are formed in a step shape, and have step faces; a first connection pad and a second connection pad arranged on the step faces of one side face in the four side faces of the opening portion so as to be adjacent each other, the first connection pad and the second connection pad exposed from an inner face of the opening portion, the first connection pad and the second connection pad each connected to one of the wiring layer; a resin portion formed in the opening portion of the wiring substrate, the resin portion burying the first connection pad and the second connection pad; a first bonding wire buried in the resin portion, the first bonding wire in which one end is connected to the first connection pad and the other end constitutes a protruding portion protruding from a lower face of the resin portion; a first contact terminal formed from the protruding portion of the first bonding wire, the first contact terminal protruding downward from the lower face of the resin portion, in a state that a whole of a side face of the first contact terminal is exposed from the resin portion, wherein the first contact terminal and the first bonding wire are formed of one bonding wire which is made of the same metal; a second bonding wire buried in the resin portion, the second bonding wire in which one end is connected to the second connection pad and the other end constitutes protruding portion protruding from the lower face of the resin portion; and a second contact terminal formed from the protruding portion of the second bonding wire, the second contact terminal protruding downward from the lower face of the resin portion, in a state that a whole of a side face of the second contact terminal is exposed from the resin portion, wherein the second contact terminal and the second bonding wire are formed of one bonding wire which is made of the same metal; wherein each diameter of the first contact terminal and the second contact terminal is equal to each diameter of the first bonding wire and the second bonding wire in the resin portion, and the first contact terminal and the second contact terminal are inclined in the same direction toward a center side of the resin portion, from a root exposed from a lower face of the resin portion to a tip in the first connection pad and the second connection pad, and the first contact terminal and the second contact terminal contact one electrode pad of a test object in a pair.