PROXIMITY LUMINANCE SENSOR AND METHOD FOR MANUFACTURING SAME

摘要

The present invention relates to a proximity luminance sensor obtained by assembling a housing array to a printed circuit board array using an adhesive layer, prior to separation into individual proximity luminance sensors, thereby preventing contamination or damage to lenses, decreasing the optical interference phenomenon, reducing the manufacturing cost and manufacturing time, and thus substantially improving productivity. The proximity luminance sensor may comprise: a printed circuit board; a light-emitting chip mounted on the printed circuit board; a light-receiving chip mounted on the printed circuit board; a light-emitting lens unit surrounding the light-emitting chip; a light-receiving lens unit surrounding the light-receiving chip; a housing shaped to surround the light-emitting chip and the light-receiving chip and provided with a light-emitting window, which corresponds to the light-emitting lens unit, and a light-receiving window, which corresponds to the light-receiving lens unit; and an adhesive layer installed between the housing and the printed circuit board.

主权项

1. A method of manufacturing a proximity luminance sensor, the method comprising:
mounting a plurality of light-emitting chips and a plurality of light-receiving chips on a printed circuit board array, and connecting a signal transmitting member to each of the chips; molding a light-emitting lens unit surrounding the light-emitting chips and a light-receiving lens unit surrounding the light-receiving lens unit on the printed circuit board array; assembling a housing array having a light-emitting window corresponding to the light-emitting lens unit and a light-receiving window corresponding to the light-receiving lens unit to the printed circuit board array where the light-emitting lens unit and the light-receiving lens unit are molded; and separating individual proximity luminance sensors from the printed circuit board array assembled with the housing array.